PLASTIC ELECTRONIC GMBH - Austria 

Ranking results:

Past rankings:

2010
Criterium:Position:
Overall Score:> 1000
Networking Rank (Reputation):> 1000
2008
Criterium:Position:
Overall Score:> 1000
Networking Rank (Reputation):> 1000

Ranking timeline:

Project Participation Performance(2010-01-01 - 2024-12-31 ):

Total Project Funding:

Total funding allocated to projects this organisation participated or coordinated

Funding per Partner:

Since 2014 individual funding per partner. If data is not available at CORDIS: total funding / No of participants.

Projects:

Leadership:

Total number of projects: 2
As coordinator: 0
As participant: 2
Sole participant: 0
Coordinator / Participant Ratio: 0*

*Ratio includes only projects with > 2 partners

Summary:

Total project funding [€]:Projects [No]:
Year:coordinator*participant*per partner  as coordinatoras participant
2013 0 5.000.000 312.500 1
2010 0 2.980.000 261.819 1
*n.b.: These numbers represent the total amount of funds allocated to projects this institution has participated in, not the funding allocated to this institution

Networking:

Partners:

Institution:Projects [No]:
INTERUNIVERSITAIR MICRO ELECTRONICA CENTRUM VZW2
NEDERLANDSE ORGANISATIE VOOR TOEGEPAST NATUURWETENSCHAPPELIJK ONDERZOEK TNO2
ADVANCED CIRCUIT BOARDS NV1
BESI AUSTRIA1
CENTRO RICERCHE FIAT S C P A1
ENMECH GMBH & CO KG1
FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E V1
FREUDENBERG FORSCHUNGSDIENSTE SE & CO KG1
FUNDICO BVBA1
KONINKLIJKE DSM NV1
NIEBLING1
ORBOTECH1
PAGE ELECTRONICA NV1
PHILIPS LIGHTING BV1
POLE EUROPEEN DE PLASTURGIE1
QOLPAC BV1
QUAD INDUSTRIES NV1
SINTEX NP SAS1
TECHNISCHE UNIVERSITEIT DELFT1
TP VISION BELGIUM NV1

Constancy:

Total number of partners: 22
Partner loyalty:
Frequent Partner: (> 2 projects): 0
Rare Partner: 22
Frequent / Rare Partner Ratio: 0

Project overview:

Start dateProjectacronymrolefundingpartners
2013-10-01Thermoplastically deformable circuits for embedded randomly shaped electronics TERASELparticipant5.000.00016
2010-01-01Ultra thin chip integration process for low cost communicative polymer foils Chip2Foilparticipant2.980.0008