2019 | |
---|---|
Criterium: | Position: |
Overall Score: | > 1000 |
Total Project Funding per Partner: | > 1000 |
Total Number of Projects: | > 1000 |
2018 | |
Criterium: | Position: |
Overall Score: | > 1000 |
Total Project Funding per Partner: | > 1000 |
Total Number of Projects: | > 1000 |
Networking Rank (Reputation): | > 1000 |
2016 | |
Criterium: | Position: |
Overall Score: | > 1000 |
Networking Rank (Reputation): | > 1000 |
2015 | |
Criterium: | Position: |
Overall Score: | > 1000 |
Networking Rank (Reputation): | > 1000 |
Total number of projects: 6
As coordinator: 0
As participant: 6
Sole participant: 0
Coordinator / Participant Ratio: 0*
Total project funding [€]: | Projects [No]: | |||||
---|---|---|---|---|---|---|
Year: | coordinator* | participant* | per partner | as coordinator | as participant | |
2022 | 0 | 21.859.932 | 92.054 | 1 | ||
2021 | 0 | 24.855.414 | 126.695 | 1 | ||
2019 | 0 | 8.561.599 | 106.864 | 1 | ||
2018 | 0 | 38.598.048 | 187.320 | 2 | ||
2016 | 0 | 8.310.755 | 163.538 | 1 |
Total number of partners: 146
Partner loyalty:
Frequent Partner: (> 2 projects): 36
Rare Partner: 110
Frequent / Rare Partner Ratio: 0.33
Start date | Project | acronym | role | funding | partners |
---|---|---|---|---|---|
2022-12-01 | 14 Anstrom CMOS IC technology | 14ACMOS | participant | 21.859.932 | 25 |
2021-06-01 | Integration of processes and moDules for the 2 nm node meeting Power Performance Area and Cost requirements | ID2PPAC | participant | 24.855.414 | 27 |
2019-05-01 | Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe | APPLAUSE | participant | 8.561.599 | 31 |
2018-11-01 | first and euRopEAn siC eigTh Inches pilOt liNe | REACTION | participant | 10.401.952 | 30 |
2018-10-01 | Technology Advances for Pilotline of Enhanced Semiconductors for 3nm | TAPES3 | participant | 28.196.096 | 27 |
2016-10-01 | Optimised Real-world Cost-Competitive Modular Hybrid Architecture for Heavy Duty Vehicles | ORCA | participant | 8.310.755 | 12 |