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| Start date | Project | acronym | role | funding | partners |
|---|
| 2023-01-01 | Heterogeneous Integration for Connectivity and Sustainability |
HICONNECTS | participant | 24.655.938 | 64 |
| 2023-01-01 | Agile uLtra Low EnerGy secuRe netwOrks |
ALLEGRO | participant | 11.829.201 | 23 |
| 2023-01-01 | Semantic Low-code Programming Tools for Edge Intelligence |
SMARTEDGE | participant | 7.353.640 | 15 |
| 2023-01-01 | Deep Programmability and Secure Distributed Intelligence for Real-Time End-to-End 6G Networks |
DESIRE6G | participant | 5.874.905 | 14 |
| 2023-01-01 | Machine Learning for Autonomic System Operation in the Heterogeneous Edge-Cloud Continuum |
MLSysOps | participant | 5.711.250 | 12 |
| 2023-01-01 | Distributed Artificial Intelligence-driven open and programmable architecture for 6G networks |
ADROIT6G | participant | 5.999.999 | 13 |
| 2022-10-01 | Wafer-scale platform for Photonic Programmable Multipurpose Integrated Circuits |
PHORMIC | participant | 4.994.184 | 9 |
| 2022-10-01 | Laser digital transfer of 2D materials enabled photonics: from the lab 2 the fab |
L2D2 | participant | 2.499.975 | 5 |
| 2022-09-01 | Optical circuit switched time sensitive network architecture for high-speed passive optical networks and next generation ultra-dynamic and reconfigurable central office environments |
OCTAPUS | participant | 4.789.661 | 11 |
| 2022-09-01 | XR mEdia eCOsystem |
XRECO | participant | 8.331.200 | 20 |
| 2022-09-01 | Low-coSt and energy-efficient hybrid Photonic integrated circuits for fibeR-optic, free-space optIcal and mmWave commuNication systems supporting Time critical networking in industrial EnviRonments |
SPRINTER | participant | 5.999.935 | 12 |
| 2022-09-01 | Quantum resistant communications: Advance Learning in applied PQC Training |
QUARC | participant | 2.254.694 | 5 |
| 2022-09-01 | Packaging of novel Ultra-dyNamiC pHotonic switches and transceivers for integration into 5G radio access network and datacenter sub-systems |
PUNCH | participant | 4.274.284 | 8 |
| 2021-06-01 | Integration of processes and moDules for the 2 nm node meeting Power Performance Area and Cost requirements |
ID2PPAC | participant | 24.855.414 | 27 |
| 2021-06-01 | Materials for Quantum Computing |
MATQu | participant | 6.548.524 | 18 |
| 2021-01-01 | Advanced GeSi components for next-generation silicon photonics applications |
SIPHO-G | participant | 4.996.208 | 9 |
| 2021-01-01 | MACHINE LEARNING-BASED, NETWORKING AND COMPUTING INFRASTRUCTURE RESOURCE MANAGEMENT OF 5G AND BEYOND INTELLIGENT NETWORKS |
MARSAL | participant | 6.126.684 | 14 |
| 2021-01-01 | TRANSPARENT APPLICATION DEPLOYMENT IN A SECURE, ACCELERATED AND COGNITIVE CLOUD CONTINUUM |
SERRANO | participant | 4.343.180 | 11 |
| 2020-11-01 | Integrating 5G enabling technologies in a holistic service to physical layer 5G system platform |
Int5Gent | participant | 5.948.030 | 16 |
| 2020-10-01 | Graphene Flagship 2D Experimental Pilot Line |
2D-EPL | participant | 20.000.000 | 196 |
| 2020-10-01 | CMOS compatible and ultra broadband on-chip SiC frequency comb |
SiComb | participant | 2.914.295 | 7 |
| 2020-09-01 | Future Proofing of ICT Trust Chains: Sustainable Operational Assurance and Verification Remote Guards for Systems-of-Systems Security and Privacy |
ASSURED | participant | 4.999.760 | 16 |
| 2020-09-01 | Towards a Sophisticated SIEM Marketplace for Blockchain-based Threat Intelligence and Security-as-a-Service |
PUZZLE | participant | 3.999.934 | 14 |
| 2020-05-01 | Big data pRocessing and Artificial Intelligence at the Network Edge |
BRAINE | participant | 4.752.312 | 27 |
| 2020-04-01 | Graphene Flagship Core Project 3 |
GrapheneCore3 | participant | 150.000.000 | 199 |
| 2020-01-01 | CoPackaging of Terabit direct-detection and coherent Optical Engines and switching circuits in mulTI-Chip moduleS for Datacenter networks and the 5G optical fronthaul |
POETICS | participant | 5.814.569 | 8 |
| 2020-01-01 | Energy- and Size-efficient Ultra-fast Plasmonic Circuits for Neuromorphic Computing Architectures |
PlasmoniAC | participant | 3.999.459 | 12 |
| 2020-01-01 | Neuro-augmented 112Gbaud CMOS plasmonic transceiver platform for Intra- and Inter-DCI applications |
NEBULA | participant | 5.999.191 | 14 |
| 2019-12-01 | Towards the neW era of 1.6 Tb/s System-In-Package transceivers for datacenter appLIcations exploiting wafer-scale co-inteGration of InP membranes and InP-HBT elecTronics |
TWILIGHT | participant | 5.080.621 | 6 |
| 2019-11-01 | A unified network, Computational and stOrage resource Management framework targeting end-to-end Performance optimization for secure 5G muLti-tEchnology and multi-Tenancy Environments |
5G-COMPLETE | participant | 5.966.088 | 13 |
| 2019-09-02 | Open European Quantum Key Distribution Testbed |
OPENQKD | participant | 14.999.990 | 38 |
| 2019-09-01 | Scalable Software Defined Network Architectures for Cooperative Live Media Production exploiting Virtualised Production Resources and 5G Wireless Acquisition |
VIRTUOSA | participant | 1.995.500 | 4 |
| 2019-04-01 | Metrology Advances for Digitized ECS industry 4.0 |
MADEin4 | participant | 29.382.452 | 47 |
| 2019-01-01 | Indium-Phosphide Pilot Line for up-scaled, low-barrier, self-sustained, PIC ecosystem |
InPulse | participant | 14.349.729 | 17 |
| 2019-01-01 | MASS manufacturing of TrAnsceiveRs for Terabit/s era |
MASSTART | participant | 5.999.936 | 11 |
| 2019-01-01 | Micro assembled Terabit/s capable optical transceivers for Datacom applications |
Caladan | participant | 5.846.729 | 10 |
| 2019-01-01 | Fabrication and assembly automation of TERabit optical transceivers based on InP EML arrays and a Polymer Host platform for optical InterConnects up to 2 km and beyond |
TERIPHIC | participant | 4.737.469 | 6 |
| 2018-11-01 | Laser EnAbled TransFer of 2D Materials |
LEAF-2D | participant | 2.851.030 | 7 |
| 2018-10-01 | Continuous Variable Quantum Communications |
CiViQ | participant | 9.974.006 | 21 |
| 2018-10-01 | Affordable Quantum Communication for Everyone: Revolutionizing the Quantum Ecosystem from Fabrication to Application |
UNIQORN | participant | 9.979.905 | 17 |
| 2018-04-01 | Graphene Flagship Core Project 2 |
GrapheneCore2 | participant | 88.000.000 | 188 |
| 2018-01-01 | Monolithic cointegration of QD-based InP on SiN as a versatile platform for the demonstration of high performance and low cost PIC transmitters |
MOICANA | participant | 3.999.302 | 8 |
| 2018-01-01 | 3D Photonic integration platform based on multilayer PolyBoard and TriPleX technology for optical switching and remote sensing and ranging applications |
3PEAT | participant | 3.993.285 | 9 |
| 2017-12-01 | Wafer-scale, CMOS integration of photonics, plasmonics and electronics devices for mass manufacturing 200Gb/s non-return-to-zero (NRZ) transceivers towards low-cost Terabit connectivity in Data Centers |
plaCMOS | coordinator | 4.036.378 | 7 |
| 2017-09-01 | 5G integrated Fiber-Wireless networks exploiting existing photonic technologies for high-density SDN-programmable network architectures |
5G-PHOS | participant | 7.848.541 | 16 |
| 2017-06-01 | 5G Programmable Infrastructure Converging disaggregated neTwork and compUte REsources |
5G-PICTURE | participant | 7.997.250 | 19 |
| 2016-01-01 | A generic CMOS-compatible platform for co-integrated plasmonics/photonics/electronics PICs towards volume manufacturing of low energy, small size and high performance photonic devices |
PLASMOfab | participant | 3.580.691 | 10 |
| 2015-02-01 | eNd to End scalable and dynamically reconfigurable oPtical arcHitecture for application-awarE SDN cLoud datacentErs |
NEPHELE | participant | 3.053.636 | 7 |
| 2013-11-01 | Broadband Integrated and Green Photonic Interconnects for High-Performance Computing and Enterprise Systems |
BIG PIPES | participant | 3.240.000 | 7 |
| 2012-10-01 | Multi-coRe, multi-level, WDM-enAbled embedded optical enGine for Terabit board-to-board and rack-to-rack parallel optics |
MIRAGE | participant | 2.999.964 | 8 |
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